UK Tenders: Live Public Sector Contracts

Scotland has the highest drug and alcohol related death rates in the UK and Europe. People with substance use issues (PWSUI) often need help outside normal 'office' hours or from a distance from offices, and support is not uniformly available throughout Scotland. The support landscape in Scotland is fragmented, hard to navigate, and varies by locality. When support isn’t readily available (or isn’t trusted), people and their families and friends often default to emergency services or remain unsupported. As a result, those who use substances often experience avoidable crisis escalation, or remain in extremely difficult situations, and support services miss opportunities for early, harm-reducing interventions. The Preventing Harm, Promoting Recovery: Scotland’s Alcohol & Drugs Strategic Plan 2026 – 2035 specifically addresses the crucial need to tackle early intervention and widen an individual’s ‘circle of support’. This ‘circle of support’ is at the heart of this Challenge, and a successful solution would enable people to access the right support sooner, regardless of locality. It should harness the power of existing trusted services, family and community to reduce avoidable demand on emergency and NHS services – and if possible, create a ‘feedback loop’ of learning, intelligence and insight so that the overall issue can be tackled in a continually improving manner.

Strathclyde Pharma Solutions, a research group within University of Strathclyde's Strathclyde Institute for Pharmacy and Biomedical Sciences is a MHRA licensed manufacturing facility, supplying investigative medicinal products to clinical trials. We require a Supplier to undertake annual servicing and calibration of equipment as well as service cover for emergency call out. As part of our clean room facility, we generate our own Water For Injection which feeds associated equipment. The WFI System comprises of a 500L 316L stainless steel tank, circulation pump, control panel and a circulation loop of pipe work with 4 off-take sample areas. This system is connected to the Telstar Steam Generator, the Telstar Freeze Drier Clean in Place system and the Lancer Washer. The whole system is operated under automatic control. The Contracting Authority is seeking a supplier who will perform annual maintenance, and where appropriate, calibration. Additional equipment that also require to be serviced and all equipment is listed below. - Telstar GVP 86E Pure Steam Generator with Condensing Unit - Storage vessels - Distribution loops incl. POU valves on WFI loop, and PSG loop - Telstar Oven HED 500 - Telstar Autoclave AVV 350 DV - Lancer Glassware Washer 1600 PCM DPSS

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for waveguide writing equipment capable of performing waveguide writing using laser beam for photonics packaging applications.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical transceiver tester capable of performing comprehensive testing of optical transceivers for photonic packaging applications.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber.

The University requires the establishment of a 2-lot Framework Agreement for various forms of Tax Advice.

The University of Strathclyde is seeking to appoint selected suppliers to provide packages of training courses tailored for postgraduate and doctorate students and covering various topics grouped into 6 Lots.

The SUMIT (Substance Use and Mental Health Interventions using Digital Technology) Project is supported by PEACEPLUS, a programme managed by the Special EU Programmes Body (SEUPB). The SUMIT Project will jointly develop, implement and evaluate a digitally enabled approach to enhance and inform the transformation of services within a test bed environment for 1,500 beneficiaries, adding value through three interrelated activities. 1. Collaborate with 4 local demonstrator sites in Northern Ireland (NI), the border counties of the Republic of Ireland (ROI) and Scotland (SCO) to deliver a comprehensive skills development programme for 500 staff and facilitate good practice and knowledge exchange through a Community of Practice to enable implementation of digital products. 2. Codesign, develop and implement 3 digital products for people to confidently use digital devices and products to access support and improve health and wellbeing. 3. Undertake crossborder research and project evaluation to robustly evidence ‘what works,’ and apply learning throughout the project to inform service delivery, organisational change and policy development to reduce inequalities and foster resilient health and social care systems. The procurement is structured into three distinct but interrelated lots: - Lot 1 – Self-directed Help: Digital tools enabling individuals to access information, guidance and support independently, including anonymous access where appropriate. - Lot 2 – Personalised Journey: Solutions supporting ongoing recovery and wellbeing through personalised tracking, goalsetting, service navigation and peer interaction. - Lot 3 – Data Sharing: Capabilities to support person held records and controlled data sharing across services, reducing duplication and enabling continuity of care. A key objective of the contract is to deliver outcome based digital solutions, rather than prescriptive technical systems. Bidders are therefore required to demonstrate how their solutions achieve defined user and service outcomes, including improved access to support services, sustained user engagement, increased digital inclusion, and enhanced service insight through data and analytics. This approach reflects the programme’s emphasis on codesign and participatory development, ensuring that solutions are aligned with real user needs and are capable of achieving meaningful adoption. Queens University Belfast (QUB) is the overall lead for the project with the Digital Health & Care Innovation Centre (DHI hosted by University of Strathclyde) leading on activity 2 above. In delivery with the wider SUMIT partners, DHI is seeking to develop and implement innovative routes to market for the crossborder procurement of 3 digitally enabled products. All solutions and services delivered under this contract must comply with all applicable data protection legislation in force within the jurisdictions of delivery, including the EU General Data Protection Regulation (EU GDPR) as implemented in the Republic of Ireland, and the UK General Data Protection Regulation (UK GDPR) together with the Data Protection Act 2018. The Contractor shall ensure that its solution remains fully compliant with these statutory requirements at all times throughout the term of the contract. This contract will also be available for use by SUMIT Core Partners; Queen’s University Belfast, Trinity College Dublin, University of St Andrews, Scottish Council for Voluntary Organisations and Associate Partners; Alcohol Forum Ireland, Developing Healthy Communities NI, Dundalk Institute of Technology, North Eastern Regional Drug & Alcohol Task Force.